Thermal Design of Control Panel Systems

Abstract

With the miniaturization, integration, and modularization of aerospace avionics, the installation density of electronic components has significantly increased. Consequently, thermal design for electrical devices and heat dissipation problem in printed circuit boards (PCBs) has emerged as critical challenges. Grounded in heat transfer theory, this paper systematically summarizes conventional heat dissipation method. Taking the control power supply unit of a civil aircraft as a case study, the study quantitatively compares operational temperature differentials before and after thermal optimization. The results validate the effectiveness of the proposed heat dissipation method, demonstrating measurable enhancements to aviation safety.